Fluid ejector apparatus and methods

ABSTRACT

A fluid ejector head, includes a fluid ejector body adapted to be inserted into an opening of an enclosing medium having an interior surface, and at least one nozzle disposed on the fluid ejector body. The fluid ejector head further includes, a fluid ejector actuator in fluid communication with the at least one nozzle, wherein activation of the fluid ejector actuator ejects a fluid through the at least one nozzle at controlled locations onto the interior surface of the enclosing medium.

BACKGROUND

[0001] Description of the Art

[0002] Over the past decade, substantial developments have been made inthe micro-manipulation of fluids in fields such as electronic printingtechnology using inkjet printers. Currently there is a wide variety ofhighly-efficient inkjet printing systems in use, which are capable ofdispensing ink in a rapid and accurate manner onto paper sheets or otherrelatively flat media such as envelopes or labels.

[0003] Typically, an inkjet printing system utilizes a platen to which apaper sheet or other relatively flat and flexible medium is transportedby friction utilizing various motors, gears, wheels, shafts and mounts.This medium transport mechanism, typically, provides the movementenabling the medium to be acquired from a tray and then advanced througha print zone by pushing, pulling, or carrying the medium. The print zonetypically locates the medium relative to the printhead. A nearly flatprint zone is, typically, utilized because the two-dimensional extent oftypical nozzle layouts would result in varying firing distances if themedium or medium support has to much curvature. A carriage holding oneor more print cartridges, having one or more fluid ejector heads, is,typically, supported by a slide bar, or similar mechanism within thesystem, and physically propelled along the slide bar to allow thecarriage to be translationally reciprocated or scanned back and forthacross the medium. When a swath of ink dots has been completed, themedium is moved an appropriate distance along the medium sheet axis, inpreparation for the next swath.

[0004] The ability, to utilize fluid ejectors and fluid dispensingsystems, to dispense discrete deposits of a material onto the surface ofmedia of various shapes and flexibility, in specified locations, wouldopen up a wide variety of applications that are currently impractical.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005]FIG. 1a is a perspective view of a fluid ejector head according toan embodiment of the present invention;

[0006]FIG. 1b is a perspective view of a fluid ejector head according toan alternate embodiment of the present invention;

[0007]FIG. 2a is an isometric cross-sectional view of a fluid ejectorbody according to an alternate embodiment of the present invention;

[0008]FIG. 2b is a perspective view of a portion of the fluid ejectorbody shown in FIG. 2a according to an embodiment of the presentinvention;

[0009]FIG. 3 is a cross-sectional view of a fluid ejector body accordingto an alternate embodiment of the present invention;

[0010]FIG. 4 is a cross-sectional view of a fluid ejector body accordingto an alternate embodiment of the present invention;

[0011]FIG. 5 is a cross-sectional view of a fluid ejector body accordingto an alternate embodiment of the present invention;

[0012]FIG. 6a is a perspective view of a fluid ejection cartridgeaccording to an embodiment of the present invention;

[0013]FIG. 6b is a perspective view of a fluid dispensing systemaccording to an embodiment of the present invention;

[0014]FIG. 7 is a flow diagram of a method of manufacturing a fluidejector head according to an embodiment of the present invention;

[0015]FIG. 8 is a flow diagram of a method of using a fluid dispensingsystem according to an embodiment of the present invention;

[0016]FIG. 9a is a perspective view of an article made using anembodiment of the present invention;

[0017]FIG. 9b is a perspective view of an article made using anembodiment of the present invention;

[0018]FIG. 9c is a perspective view of an article made using anembodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Referring to FIG. 1a, an embodiment of the present invention isshown in a perspective view. In this embodiment, fluid ejector head 100includes fluid ejector body 120 adapted to be inserted into enclosingmedium opening 108. Fluid ejector head 100 further includes nozzles 130disposed on fluid ejector body 120 and fluidically coupled to fluidchannel 140. Fluid ejector actuator 150 is in fluid communication withnozzles 130. Activation of fluid ejector actuator 150 ejects a fluidonto a predetermined location onto interior surface 110 of enclosingmedium 106.

[0020] For purposes of this description and the present invention, theterm enclosing medium may be any solid or semi-solid material objectwith a shape, having a substantially fixed form, including an inside, orinterior, surface and an outer, or exterior, surface. The termsubstantially fixed form is used to imply permanence of the interiorsurface of the object not of the shape of the object. For example, a bagmay change shape depending on whether it is open or closed, however, theexistence of the interior surface remains whether open or closed. Inaddition, the substantially fixed form also includes at least oneopening having a cross-sectional area less than the maximumcross-sectional area obtainable for that shape. The enclosing medium mayhave rectangular parallelepiped, cylindrical, ellipsoidal, or sphericalshapes just to name a few simple geometric shapes that may be utilized.For example, enclosing medium 106 may be a vial, a bottle, a capsule, abox, a bag, or a tube to name a few articles that may be utilized. Inalternate embodiments, as shown in FIG. 1b, enclosing medium 106 mayinclude a bottom surface such as a vial or gelatin capsule. In additionfluid ejector head 100′ may also include nozzles providing ejection ofthe fluid onto bottom interior surface 109, as well as the side interiorsurface 110′, of the capsule as shown in FIG. 1b.

[0021] In this embodiment fluid ejector body 120 includes multiple boresor nozzles 130, the actual number shown in FIGS. 1a and 1 b is forillustrative purposes only. The number of nozzles utilized depends onvarious parameters such as the particular fluid or fluids to bedispensed, the particular deposits to be generated, and the particularsize of the enclosing medium utilized. In this embodiment, either fluidejector body 120 or enclosing medium 106 or both are rotatable about thelongitudinal axis 112 of enclosing medium 106 providing the ability todispense fluid in a two-dimensional array on the interior surface of theenclosing medium. Fluid ejector head 100 provides control of fluiddeposits by dispensing the fluid in discrete amounts on the inside of anenclosing medium in a controlled manner.

[0022] It should be noted that the drawings are not true to scale.Further, various elements have not been drawn to scale. Certaindimensions have been exaggerated in relation to other dimensions inorder to provide a clearer illustration and understanding of the presentinvention.

[0023] In addition, although some of the embodiments illustrated hereinare shown in two dimensional views with various regions having depth andwidth, it should be clearly understood that these regions areillustrations of only a portion of a device that is actually a threedimensional structure. Accordingly, these regions will have threedimensions, including length, width, and depth, when fabricated on anactual device. Moreover, while the present invention is illustrated byvarious embodiments, it is not intended that these illustrations be alimitation on the scope or applicability of the present invention.Further it is not intended that the embodiments of the present inventionbe limited to the physical structures illustrated. These structures areincluded to demonstrate the utility and application of the presentinvention to presently preferred embodiments.

[0024] Fluid ejector body 120, in this embodiment, is a tubular shapedstructure having an outside diameter less than the inside diameter ofenclosing medium opening 108, such that fluid ejector body 120 isinsertable into enclosing medium opening 108, along longitudinal axis112, of enclosing medium 106. In this embodiment, fluid ejector body 120also includes a fluid ejector body longitudinal axis 111 that is alignedwith longitudinal axis 112 of enclosing medium 106. In alternateembodiments, depending on various parameters such as the shape of theenclosing medium and the fluid ejector body, the fluid ejector bodylongitudinal axis may not be in alignment with the longitudinal axis ofthe enclosing medium. Fluid ejector body 120 may utilize any ceramic,metal, or plastic material capable of forming the appropriate sizedtubular shape. Fluid ejector actuator 150 may be any device capable ofimparting sufficient energy to the fluid either in fluid channel 140 orin close proximity to nozzles 130. For example, compressed airactuators, such as utilized in an airbrush, or electro-mechanicalactuators or thermal mechanical actuators may be utilized to eject thefluid from nozzles 130.

[0025] An exemplary embodiment of a fluid ejector head is shown in anisometric cross-sectional view in FIG. 2a. In this embodiment, fluidejector head 200 includes fluid ejector body 220 wherein at least aportion of the body has a rectangular cross-section. In alternateembodiments, fluid ejector body may have a parallelepiped structure. Inaddition, fluid ejector body 220 also includes fluid body longitudinalaxis 211 projecting in and out of the cross sectional view. Fluidejector body 220 is adapted to be inserted into an opening of anenclosing medium and is rotatable within the enclosing medium. Inaddition, nozzle 230 has an ejection axis 231 defining the generaldirection in which drops are ejected from fluid ejector body 220. Fluidbody longitudinal axis 211 and nozzle ejection axis 231 formpredetermined ejection angle 218 (see FIG. 2b). In this embodiment,nozzle ejection axis 231 may be aligned at an angle between 0° and 60°degrees from fluid body normal 211′ of fluid body longitudinal axis 211as shown in a perspective view in FIG. 2b. In alternate embodiments,nozzle ejection axis 232 is aligned at an angle between 0° and 45°, andmore preferably nozzle ejection axis 232 is substantially perpendicularto fluid body longitudinal axis 211. In addition, ejection angles 231′and 231″ illustrate that the angle may be either in a positive or in anegative direction relative to fluid body normal 211′.

[0026] Fluid ejector head 200 further includes fluid ejector actuator250, chamber layer 266, fluid body housing 280, and nozzle layer 236. Inthis embodiment, substrate 222 is a portion of a silicon wafer. Inalternate embodiments, other materials may also be utilized forsubstrate 222, such as, various glasses, aluminum oxide, polyimidesubstrates, silicon carbide, and gallium arsenide. Accordingly, thepresent invention is not intended to be limited to those devicesfabricated in silicon semiconductor materials. In this embodiment, fluidbody housing 280 and substrate 222 form fluid channel 240. Fluid inletchannels 241 are formed in substrate 222, and provide fluidic couplingbetween fluid channel 240 and fluid ejection chamber 272.

[0027] Fluid energy generating element 252 is disposed on substrate 222and provides the energy impulse utilized to eject fluid from nozzle 230.As described above, fluid ejector actuator 250 may be any elementcapable of imparting sufficient energy to the fluid to eject it fromnozzle 230. In this embodiment, fluid ejector actuator 250 includesfluid energy generating element 252, which is a thermal resistor. Inalternate embodiments, other fluid energy generating elements such aspiezoelectric, flex-tensional, acoustic, and electrostatic generatorsmay also be utilized. For example, a piezoelectric element utilizes avoltage-pulse to generate a compressive force on the fluid resulting inejection of a drop of the fluid. In still other embodiments, fluidenergy generating element 252 may be located some distance away, in alateral direction, from nozzle 230. The particular distance will dependon various parameters such as the particular fluid being dispensed, theparticular structure of chamber 272, and the structure and size of fluidchannel 240, to name a few parameters.

[0028] The thermal resistor is typically formed as a tantalum aluminumalloy utilizing conventional semiconductor processing equipment. Inalternate embodiments, other resistor alloys may be utilized such astungsten silicon nitride, or polysilicon. The thermal resistor typicallyis connected to electrical inputs by way of metallization (not shown) onthe surface of substrate 222. Additionally, various layers of protectionfrom chemical and mechanical attack may be placed over the thermalresistor, but are not shown in FIG. 2 for clarity. Substrate 222 alsoincludes, in this embodiment, active devices such as one or moretransistors (not shown for clarity) electrically coupled to fluid energygenerating element 252. In alternate embodiments, other active devicessuch as diodes or memory logic cells may also be utilized, eitherseparately or in combination with the one or more transistors. In stillother embodiments, what is commonly referred to as a “direct drive”fluid ejector head, where substrate 222 may include fluid ejectorgenerators without active devices, may also be utilized. The particularcombination of active devices and fluid energy generating elements willdepend on various parameters such as the particular application in whichfluid ejector head 200 is used, and the particular fluid being ejectedto name a couple of parameters.

[0029] In this embodiment, an energy impulse applied across the thermalresistor rapidly heats a component in the fluid above its boiling pointcausing vaporization of the fluid component resulting in an expandingbubble that ejects fluid drop 214 as shown in FIG. 2a. Fluid drop 214typically includes droplet head 215, drop-tail 216 and satellite-drops217, which may be characterized as essentially a fluid drop. In thisembodiment, each activation of energy generating element 252 results inthe ejection of a precise quantity of fluid in the form of essentially afluid drop; thus, the number of times the fluid energy generatingelement is activated controls the number of drops 214 ejected fromnozzle 230 (i.e. n activations results in essentially n fluid drops).Thus, fluid ejector head 200 may generate deposits of discrete dropletsof a fluid, including a solid material dissolved in one or more solventsor suspended or dispersed in the fluid, onto a discrete predeterminedlocation on the interior surface of an enclosing substrate

[0030] The drop volume of fluid drop 214 may be optimized by variousparameters such as nozzle bore diameter, nozzle layer thickness, chamberdimensions, chamber layer thickness, energy generating elementdimensions, and the fluid surface tension to name a few. Thus, the dropvolume can be optimized for the particular fluid being ejected as wellas the particular application in which the enclosing medium will beutilized. Fluid ejector head 200 described in this embodiment canreproducibly and reliably eject drops in the range of from about fivefemtoliters to about 10 nanoliters depending on the parameters andstructures of the fluid ejector head as described above. In alternateembodiments, fluid ejector head 200 can eject drops in the range fromabout 5 femtoliters to about 1 microliter. In addition, according toother embodiments, multiple fluid ejector heads 200 may be gangedtogether to form polygonal structures. For example, two fluid ejectorheads 200 may be formed back to back providing the ability to dispensetwo different fluids so that, one set of fluid ejector heads maydispense ink, and another set of fluid ejector heads may dispense asealant or protective material to cover or coat the dispensed ink. Asecond example, utilizes multiple sets of fluid ejector heads to ejectmultiple different fluids such as color inks with or without the use ofa sealant or protective material. The term fluid includes any fluidmaterial such as inks, adhesives, lubricants, chemical or biologicalreagents, as well as fluids containing dissolved or dispersed solids inone or more solvents. Further, fluid ejector head 200 may also contain afluid that is a mixture of materials providing multiple functions andthus various combinations are possible, such as one set of fluid ejectorheads ejecting an ink and protective material mixed together, andanother set ejecting just an ink.

[0031] Chamber layer 266 is selectively disposed over the surface ofsubstrate 222. Sidewalls 268 define or form fluid ejection chamber 272,around energy generating element 252, so that fluid, from fluid channel240 via fluid inlet channels 241, may accumulate in fluid ejectionchamber 272 prior to activation of energy generating element 252 andexpulsion of fluid through nozzle or orifice 230 when energy generatingelement 252 is activated. Nozzle or orifice layer 236 is disposed overchamber layer 266 and includes one or more bores or nozzles 230 throughwhich fluid is ejected. In alternate embodiments, depending on theparticular materials utilized for chamber layer 266 and nozzle layer236, an adhesive layer (not shown) may also be utilized to adhere nozzlelayer 236 to chamber layer 266. According to additional embodiments,chamber layer 266 and nozzle layer 236 are formed as a single integratedchamber nozzle layer. Chamber layer 266, typically, is a photoimagiblefilm that utilizes photolithography equipment to form chamber layer 266on substrate 222 and then define and develop fluid ejection chamber 272.The nozzles formed along longitudinal axis 211 may be in a straight lineor a staggered configuration depending on the particular application, inwhich fluid ejector head 200 is utilized, a staggered configuration isillustrated in FIG. 2b.

[0032] Nozzle layer 236 may be formed of metal, polymer, glass, or othersuitable material such as ceramic. In this embodiment, nozzle layer 236is a polyimide film. Examples of commercially available nozzle layermaterials include a polyimide film available from E. I. DuPont deNemours & Co. sold under the name “Kapton”, a polyimide materialavailable from Ube Industries, LTD (of Japan) sold under the name“Upilex.” In an alternate embodiment, the nozzle layer 236 is formedfrom a metal such as a nickel base enclosed by a thin gold, palladium,tantalum, or rhodium layer. In other alternative embodiments, nozzlelayer 236 may be formed from polymers such as polyester, polyethylenenaphthalate (PEN), epoxy, or polycarbonate.

[0033] An alternate embodiment of a fluid ejector head is shown in across-sectional view in FIG. 3. In this embodiment, fluid ejector head300 includes fluid ejector body 320, wherein at least a portion of thebody has a cylindrical cross-sectional shape, including fluid bodylongitudinal axis 311 projecting in and out of the cross sectional view.In alternate embodiments, fluid ejector body 320 may have a portionhaving a curvilinear shape. Fluid ejector head 300 further includesfluid ejector actuator 350, second fluid ejector actuator 354, and thirdfluid ejector actuator 358 disposed on fluid ejector body 320. Althoughthe fluid ejector actuators are disposed under the nozzles in thisembodiment, in alternate embodiments, the fluid ejector actuators may bepositioned some lateral distance away from the nozzles. The particulardistance will depend on various parameters such as the particular fluidbeing dispensed, the particular structure of the chambers, and thestructure and size of the fluid channels, to name a few parameters.Fluid channel separator 346 is attached to substrate 322 and separatesfluid ejector head 300 into three sections: fluid section 323, secondfluid section 324, and third fluid section 325. In this embodiment,fluid channel 340 is formed by fluid channel separator portions 346′ andsubstrate 322; second fluid channel 342 is formed by fluid channelseparator portions 346″ and substrate 322; and third fluid channel 344is formed by fluid channel separator portions 346′″ and substrate 322.

[0034] Fluid inlet channels 341 provide fluidic coupling between fluidchannel 340 and chamber 372, and are formed in substrate 322 withinfluid section 323. Fluid inlet channels 343 and 345 provide fluidiccoupling between fluid channels 342 and 344 and chambers 374 and 376respectively. Fluid energy generating element 352 is disposed onsubstrate 322 and provides the energy impulse utilized to eject fluidfrom nozzle 330. Fluid energy generating elements 356 and 360 providethe energy impulses utilized to eject fluid from nozzles 332 and 334respectively. In this embodiment, fluid energy generating elements 352,356, and 360 are thermal resistors that rapidly heat a component in thefluid above its boiling point causing vaporization of the fluidcomponent resulting in ejection of a drop of the fluid. In alternateembodiments, other fluid energy generating elements such aspiezoelectric, flex-tensional, acoustic, and electrostatic generatorsmay also be utilized. In this embodiment, fluid energy generatingelements 352, 356, and 360 eject the fluid in a substantially radialdirection onto the interior surface of the enclosing medium (not shown).

[0035] Chamber layer 366 is disposed over substrate 322 whereinsidewalls 368′ define or form a portion of fluid ejection chamber 372 influid section 323; sidewalls 368″ form a portion of second fluidejection chamber 374 in second fluid section 324; and sidewalls 368′″for a portion of fluid ejection chamber 376 in third fluid section 325.Nozzle or orifice layer 336 is disposed over chamber layer 366 andincludes one or more bores or nozzles 330, 332, and 334 through whichfluid in the three sections is ejected. In alternate embodiments,depending on the particular materials utilized for chamber layer 366 andnozzle layer 336, an adhesive layer may also be utilized to adherenozzle layer 336 to chamber layer 366. According to additionalembodiments, chamber layer 366 and nozzle layer 336 are formed as asingle layer. Such an integrated chamber and nozzle layer structure iscommonly referred to as a chamber orifice or chamber nozzle layer.

[0036] Although FIG. 3 depicts fluid ejector body 320 separated intothree sections, alternate embodiments may utilize anywhere from a singlesection to multiple sections depending on the particular application inwhich fluid ejector head 300 is utilized. For example, fluid ejectorbody 320 may have a single section to eject a single fluid. In addition,the fluid chambers formed along longitudinal axis 311 may be in astraight line, staggered configuration, or helical configurationdepending on the particular application in which fluid ejector head 300is utilized. In another example, fluid ejector body 320 includes sixsections having straight, staggered, or helical configurations,providing for any of the possible combinations of dispensing multiplefluids.

[0037] In addition to having various numbers of sections each sectionmay also be independently optimized for performance. For example, theenergy generating elements of each section may be optimized for theparticular fluid ejected by that section. In addition, the dimensions ofthe ejection chambers and nozzles may also be optimized for theparticular fluid ejected by that section. Further, energy generatingelements as well as chamber and nozzle dimensions within a section mayalso be varied providing ejection of different drop sizes of the samefluid to be ejected from fluid ejector head 300.

[0038] Referring to FIG. 4 an alternate embodiment of a fluid ejectorhead according to the present invention is shown in a cross-sectionalview. In this embodiment, fluid ejector head 400 includes fluid ejectorbody 420 having a rectangular or square tubular cross-sectional shape,including a longitudinal axis 412 projecting in and out of thecross-sectional view. Fluid ejector head 400 further includes fluidejector actuator 450, second fluid ejector actuator 454, and third fluidejector actuator 458 and fourth fluid ejector actuator 460 disposed onfluid ejector body 420. Fluid channel separator 446 is attached tosubstrate 422 and separates fluid ejector head 400 into four sections:first fluid section 440, second fluid section 424, third fluid section425, and fourth fluid section 426. For example, four different fluidsmay be utilized such as a black ink and three color inks. In anotherexample, four different reactive agents may be utilized. In still otherexamples, various combinations of different fluids such as two differentbioactive agents, an ingestible ink and a protective material to covereither the bioactive agents or ink or both may be utilized. In thisembodiment, fluid channel 440, is formed by fluid channel separatorportions 446′ and substrate 422; second fluid channel 442 is formed byfluid channel separator portions 446″ and substrate 422; third fluidchannel 444 is formed by fluid channel separator portions 446′″ andsubstrate 422; and fourth fluid channel 448 is formed by fluid channelseparator portions 446“ ” and substrate 422.

[0039] Fluid inlet channels 441 provide fluidic coupling between fluidchannel 440 and fluid ejection chamber 472, and are formed in substrate422 within fluid section 423; fluid inlet channels 443 provide fluidiccoupling between fluid channel 442 and fluid ejection chamber 474; fluidinlet channels 445 provide fluidic coupling between fluid channel 444and fluid ejection chamber 476; and fluid inlet channels 449 providefluidic coupling between fluid channel 448 and fluid ejection chamber473. Fluid energy generating elements 452, 456, 459, and 463 aredisposed on substrate 422 and provide the energy impulse utilized toeject fluid from nozzles 430, 432, 434, and 436 respectively. Asdescribed in previous embodiments, fluid energy generating elements 452,456, 459, and 463 may be any element capable of imparting sufficientenergy to the fluid to eject it from nozzles.

[0040] Chamber orifice layer 478 is disposed over substrate 422 whereinsidewalls 468 define or form a portion of fluid ejection chamber 472;sidewalls 469 form a portion of fluid ejection chamber 474; sidewalls470 form a portion of fluid ejection chamber 473; and sidewalls 471 forma portion of fluid ejection chamber 476. Chamber orifice layer 478 alsoincludes one or more bores or nozzles 430, 432, 434, and 436respectively in each section through which fluid is ejected.

[0041] Although FIG. 4 depicts fluid ejector body 420 separated intofour sections, alternate embodiments, may utilize even more sectionsdepending on the particular application in which fluid ejector head 400is utilized. For example, fluid ejector body 420 may have five or sixsections, or other number of sections, forming a pentagonal orhexagonal, or polygonal shape respectively, providing for any of thevarious possible combinations of dispensing multiple fluids, dependingon the particular application in which fluid ejector head 400 isutilized. As described above the fluid chambers and nozzles formed alonglongitudinal axis 412 may be in a straight line, or staggeredconfiguration depending on the particular application in which fluidejector head 400 is utilized. In addition, as also described above, eachsection as well as chambers, nozzles and energy generating elements mayalso be independently optimized for performance.

[0042] Referring to FIG. 5 an alternate embodiment of a fluid ejectorhead of the present invention is shown in a cross-sectional view. Inthis embodiment, fluid ejector head 500 includes fluid ejector body 520having a rectangular shape, including fluid body longitudinal axis 511projecting in and out of the cross sectional view. In addition, fluidejector head 500 includes a combination of different types of fluidejector actuators. First and second fluid ejector actuators 550 and 551are of a first type, and third and fourth fluid ejector actuators 554and 558 are of a second type. In this embodiment, first and second fluidejector actuators 550 and 551 are piezoelectric transducers 552 and 553,while third and fourth fluid ejector actuators 554 and 558 are thermalresistor energy generating elements 556 and 560 respectively.

[0043] Fluid section 523 includes diaphragm 562 attached to substrate522 and piezoelectric transducer 552, and fluid section 526 includesdiaphragm 563 attached to substrate 523 and piezoelectric transducer553. A voltage pulse applied across either piezoelectric transducer 552or 553 results in a physical displacement of the piezoelectrictransducer and the diaphragm generating a compressive force on the fluidlocated in either fluid ejection chambers 570 or 572 resulting inejection of a drop of the fluid from either nozzle 530 or 536. Chamberorifice layer 578 is disposed over substrates 522 and 523 whereinsidewalls 568 and 569 define or form a portion of fluid ejectionchambers 570 and 572 respectively. Chamber orifice layer 578 alsoincludes one or more bores or nozzles 530 and 536 through which fluid isejected. Fluid inlet channels 541 and 543 provide fluidic couplingbetween fluid channels 540 and 542 and fluid ejection chambers 570 and572, and are formed between substrate 522 and chamber orifice layer 578within fluid sections 523 and 526.

[0044] Third fluid section 524 and fourth fluid section 525 are formedby substrate 521 and channel top plate 538 of fluid ejector body 520. Inaddition, substrate 521 and channel top plate 538 form nozzles 532, and534. These two sections form what are commonly referred to as a “sideshooter” configuration, as compared to the “roof shooter” configurationillustrated in FIG. 2. In alternate embodiments, substrate 521 andsubstrate 523 may be integrated to form a single substrate havingdifferent energy generating elements disposed over different portions.In addition, substrate 522 and channel top plate 538 may also beintegrated. Third fluid inlet channel 545 provides fluidic couplingbetween third fluid channel 544 and third fluid ejection chamber 574.Fourth fluid inlet channel 547 provides fluidic coupling between fourthfluid channel 546 and fourth fluid ejection chamber 576. Fluid energygenerating elements 556 and 560 are disposed on substrate521 and providethe energy impulse utilized to eject fluid from nozzles 532 and 536respectively.

[0045] Although the embodiment illustrated in FIG. 5 shows fluidsections 523 and 526 having piezoelectric transducers and fluid sections524 and 525 having thermal resistors for ejecting a fluid, alternateembodiments may utilize any of combination of energy generating elementsdescribed in previous embodiments. Combining thermal resistor “roofshooters” and side shooters in the same fluid ejector head, or combiningpiezoelectric, and ultrasonic transducers in the same fluid ejectorhead, are just a couple of examples of combinations of various energygenerating elements that may be utilized. In another example, fluidejector head 500 may contain one section utilizing a compressed airfluid ejector actuator, a second section utilizing piezoelectric fluidenergy generating elements, and still third and fourth sectionsutilizing thermal resistor energy generating elements.

[0046] Referring to FIG. 6a an exemplary embodiment of fluid ejectioncartridge 602 of the present invention is shown in a perspective view.In this embodiment, fluid ejection cartridge 602 includes fluid ejectorhead 600 fluidically coupled to fluid reservoir 628. Fluid ejector body620 is adapted to be inserted into an enclosing medium opening (notshown). Fluid ejector head 600 further includes nozzles 630 disposed onfluid ejector body 620 and fluidically coupled to fluid channel 640.Fluid contained in fluid reservoir 628 is supplied via filter 648 tofluid channel 640. In addition, fluid ejector actuator 650 is in fluidcommunication with nozzles 630 so that fluid is ejected from nozzles 630when fluid ejector actuator is activated. In this embodiment, fluidejector actuator 650 is electrically coupled to electrical connector 668via electrical traces or wires (not shown). In alternate embodiments,utilizing, for example, compressed air, fluid ejector actuator 650 maybe coupled, to a fluid controller (see FIG. 6b), utilizing differentconnectors such as compressed air fittings and tubing. Fluid ejectorhead 600 can be any of the fluid ejector heads described in previousembodiments.

[0047] Information storage element 664 is disposed on fluid ejectioncartridge 602 as shown in FIG. 6a. Information storage element 664 iselectrically coupled to electrical connector 668. In alternateembodiments information storage element 664 may utilize a separateelectrical connector disposed on body 660. Information storage element664 is any type of memory device suitable for storing and outputtinginformation, to a controller, that may be related to properties orparameters of the fluid or fluid ejector head 600 or both. In thisembodiment, information storage element 664 is a memory chip mounted tobody 660 and electrically coupled through electrical traces 670 toelectrical connector 668. When fluid ejection cartridge 602 is eitherinserted into, or utilized in, a fluid dispensing system informationstorage element 664 is electrically coupled to a controller (not shown)that communicates with information storage element 664 to use theinformation or parameters stored therein.

[0048] Referring to FIG. 6b an exemplary embodiment of fluid dispensingsystem 604 of the present invention is shown in a perspective view. Inthis embodiment, fluid dispensing system 604 includes enclosing mediumtray 684 having an n×m array of enclosing medium holders 686 adapted toaccept insertion of enclosing medium parts 606. Fluid dispensing system604 further includes an i×j array of fluid ejection cartridges 602 thatinclude fluid ejector bodies 620 adapted to be inserted into enclosingmedium openings 608. For example, a system may utilize a tray having a4×4 array of holders containing enclosing medium parts and a 2×2 arrayof fluid ejector bodies wherein the tray is effectively divided intofour sections of 2×2 holders and the fluid ejector bodies are insertedin the enclosing medium parts in each section. In this embodiment, thearray of fluid ejection cartridges 602 is mounted to dispensing bracket688. Fluid ejector actuators 650 (see FIG. 6a) are operably coupled tofluid ejector bodies 620 and fluid controller 690 such that fluidcontroller 690 activates fluid ejector actuators (see FIG. 6a) to ejecta fluid onto the interior surface of enclosing medium parts 606. Inaddition, fluid controller 690 is operably coupled to a rotationmechanism (not shown) disposed on fluid ejection cartridges 602 torotate fluid ejector bodies 620 about a fluid body longitudinal axis(not shown).

[0049] Transport mechanism 692 is coupled to either dispensing bracket688 or enclosing medium tray 684 or both depending on the particularapplication in which dispensing system 604 is utilized. Transportmechanism 692 is operably coupled to transport controller 694, andprovides signals controlling movement of enclosing medium tray 684 toalign enclosing medium openings 608 to fluid ejector bodies 620 as wellas insert and withdraw fluid ejector bodies 620 from enclosing mediumparts 606. For example, transport mechanism 692 may move enclosingmedium tray 684 in X and Y lateral directions while raising and lowering(i.e. movement in the Z direction) dispensing bracket 688 to withdrawand insert fluid ejector bodies 620 into enclosing medium parts 606 asshown in FIG. 6b. In alternate embodiments, other combinations ofmovements may be utilized and controlled by transport mechanism 692 suchas rotation of enclosing medium tray 684 about a central axis to provideadditional alignment motion. In this embodiment, fluid controller 690and transport controller 694 may utilize any combination of applicationspecific integrated circuits (ASICs), microprocessors and programmablelogic controllers to control the various functions of fluid dispensingsystem 604. The particular devices utilized will depend on theparticular application in which fluid dispensing system 604 is utilized.In addition, dispensing system 604 may optionally include an enclosingmedium loader 698 to load enclosing medium parts 606 into enclosingmedium holders 686. Further, dispensing system 604 may also includeenclosing medium rotator 685 to rotate enclosing medium parts 606 aroundan enclosing medium longitudinal axis (see FIGS. 1a and 1 b) thus rotatethe interior surface of the enclosing medium around the fluid ejectorbody. Either rotation of enclosing medium parts 606 or rotation of fluidejector bodies 620 or both can be utilized to generate a two-dimensionalarray of discrete deposits dispensed onto the interior surface ofenclosing medium parts 606.

[0050] Optional inspection unit 696 may be utilized to provide in-line,non-destructive quality assurance testing of the manufactured articles.The particular function performed by inspection unit 696 will depend onthe particular application in which dispensing system 604 is utilized.For example inspection unit 696 may be utilized to monitor the quantityof material deposited when dispensing bioactive agent on the interiorsurface of a gelatin capsule. Another example would be monitoring areaction product when dispensing various reactants on the interiorsurface of a vial or other suitable container. For example near infraredor other optical techniques may be utilized to perform a rapid in lineassay of bioactive agent or agents on enclosing medium parts 606.Further inspection unit 696 may also be utilized to optically monitorthe quality of characters generated on the interior surface of a jar,vial or other suitable container.

[0051] Referring to FIG. 7 a flow diagram of a method of manufacturing afluid ejector head according to an embodiment of the present inventionis shown. Substrate creation process 780 includes making a substrateadapted to be inserted into an opening of an enclosing medium. Thesubstrate may be made from any ceramic, metal, or plastic materialcapable of forming the appropriate size to fit within the opening of theelongated enclosing. The particular material utilized for the substratedepends on the particular application in which the fluid ejector headwill be utilized. For example, if active devices are desirable thensubstrates having the thermal, chemical, and mechanical propertiessuitable for semiconductor processing, such as, various glasses,aluminum oxide, polyimide substrates, silicon carbide, and galliumarsenide, to name a few, may be utilized. However, if a “direct drive”is desirable then substrates having less stringent thermal, chemical andmechanical properties can be utilized, such as various plasticmaterials. Substrate creation process 780 includes forming the substratein the desired shape, such as cylindrical, rectangular, or otherpolygonal structures depending on the particular application in whichthe fluid ejector head will be utilized.

[0052] Optional active device forming process 782 utilizes conventionalsemiconductor processing equipment to form transistors, as well as otherlogic devices required for the operation of the fluid ejector head, onthe substrate. These transistors and other logic devices typically areformed as a stack of thin film layers on the substrate. The particularstructure of the transistors is not relevant to the invention, however,various types of solid-state electronic devices may be utilized, suchas, metal oxide field effect transistors (MOSFET), or bipolar junctiontransistors (BJT). As described earlier other substrate materials mayalso be utilized. Accordingly the substrate materials may also includeany of the available semiconductor materials and technologies, such asthin-film-transistor (TFT) technology using polysilicon on glasssubstrates.

[0053] Fluid energy generating element creation process 784 depends onthe particular transducer being utilized in the fluid ejector head tocreate the fluid ejector actuator. Typically, for thermal resistorelements, a resistor is formed as a tantalum aluminum alloy utilizingconventional semiconductor processing equipment, such as sputterdeposition systems for forming the resistor and etching andphotolithography systems for defining the location and shape of theresistor layer. In alternate embodiments, resistor alloys such astungsten silicon nitride, or polysilicon may also be utilized. In otheralternative embodiments, fluid drop generators other than thermalresistors, such as piezoelectric, or ultrasonic may also be utilized. Instill other embodiments, such as those utilizing compressed air thefluid ejector actuator may be created by forming one or more diaphragmsin fluid communication with the nozzles. In addition, in thoseembodiments utilizing active devices formed on the substrate, some ofthe active devices are, typically, electrically coupled to the fluidenergy generating elements by electrical traces formed from aluminumalloys such as aluminum copper silicon commonly used in integratedcircuit technology. Other interconnect alloys may also be utilized suchas gold, or copper.

[0054] Chamber layer forming process 786, depends on the particularmaterial chosen to form the chamber layer, or the chamber orifice layerwhen an integrated chamber layer and nozzle layer is used. Theparticular material chosen will depend on parameters such as the fluidbeing ejected, the expected lifetime of the fluid ejector head, thedimensions of the fluid ejection chamber and fluidic feed channels amongothers. Generally, conventional photoresist and photolithographyprocessing equipment or conventional circuit board processing equipmentis utilized. For example, the processes used to form a photoimagablepolyimide chamber layer would be spin coating and soft baking. However,forming a chamber layer, from what is generally referred to as a soldermask, would typically utilize either a coating process or a laminationprocess to adhere the material to the substrate. Other materials such assilicon oxide or silicon nitride may also be utilized as a chamberlayer, using deposition tools such as plasma enhanced chemical vapordeposition or sputtering.

[0055] Sidewall definition process 788 typically utilizesphotolithography tools for patterning. For example after either aphotoimagable polyimide or solder mask has been formed on the substrate,the chamber layer would be exposed through a mask having the desiredchamber features. The chamber layer is then taken through a developprocess and typically a subsequent final bake process after develop.Other embodiments, may also utilize a technique similar to what iscommonly referred to as a lost wax process. In this process, typically alost wax or sacrificial material that can be removed, through, forexample, solubility, etching, heat, photochemical reaction, or otherappropriate means, is used to form the fluidic chamber and fluidicchannel structures as well as the orifice or bore. Typically, apolymeric material is coated over these structures formed by the lostwax material. The lost wax material is removed by one or a combinationof the above-mentioned processes leaving a fluidic chamber, fluidicchannel and orifice formed in the coated material.

[0056] Nozzle or orifice forming process 790 depends on the particularmaterial chosen to form the nozzle layer. The particular material chosenwill depend on parameters such as the fluid being ejected, the expectedlifetime of the printhead, the dimensions of the bore, bore shape andbore wall structure among others. Generally, laser ablation may beutilized; however, other techniques such as punching, chemical milling,or micromolding may also be used. The method used to attach the nozzlelayer to the chamber layer also depends on the particular materialschosen for the nozzle layer and chamber layer. Generally, the nozzlelayer is attached or affixed to the chamber layer using either anadhesive layer sandwiched between the chamber layer and nozzle layer, orby laminating the nozzle layer to the chamber layer with or without anadhesive layer.

[0057] As described above (see FIGS. 4-5) some embodiments will utilizean integrated chamber and nozzle layer structure referred to as achamber orifice or chamber nozzle layer. This layer will generally usesome combination of the processes already described depending on theparticular material chosen for the integrated layer. For example, in oneembodiment a film typically used for the nozzle layer may have both thenozzles and fluid ejection chamber formed within the layer by suchtechniques as laser ablation or chemical milling. Such a layer can thenbe secured to the substrate using an adhesive. In an alternateembodiment a photoimagible epoxy can be disposed on the substrate andthen using conventional photolithography techniques the chamber layerand nozzles may be formed, for example, by multiple exposures before thedeveloping cycle. In still another embodiment, as described above thelost wax process may also be utilized to form an integrated chamberlayer and nozzle layer structure.

[0058] Fluid inlet channel forming process 792 depends on the particularmaterial utilized for the substrate. For example to form the fluid inletchannels in a silicon substrate a dry etch may be used when vertical ororthogonal sidewalls are desired. However, when sloping sidewalls aredesired a wet etch such as tetra methyl ammonium hydroxide (TMAH) may beutilized. In addition, combinations of wet and dry etch may also beutilized when more complex structures are utilized to form the fluidinlet channels. Other processes such as laser ablation, reactive ionetching, ion milling including focused ion beam patterning, may also beutilized to form the fluid inlet channels depending on the particularsubstrate material utilized. Micromolding, electroforming, punching, orchemical milling are also examples of techniques that may be utilizeddepending on the particular substrate material utilized.

[0059] Fluid channel forming process 794, typically, will utilize aninjection molding process to form the desired shape of the fluidchannels depending on the particular application in which the fluidejector head will be utilized. The injection molded fluid channel wouldthen be mounted, using a suitable adhesive, to either the substrate or afluid body housing depending on the particular structure being utilized.

[0060] Optional fluid body housing forming process 796, typically, willutilize an injection molding process to form the desire shape of thefluid body housing depending on the particular application in which thefluid ejector head will be utilized. In some embodiments, such as thatshown in FIGS. 2a and 2 b, fluid body housing forming process 796 andfluid channel forming process 794 may be combined in a single process toform both the fluid body housing and the fluid channels. For example, asshown in FIG. 2a attachment of the fluid body housing to the substrateutilizing an appropriate adhesive creates the fluid ejector body adaptedto be inserted into the opening of the enclosing medium. In still otherembodiments the fluid ejector body is created by the nozzle layer formedon the chamber layer formed on the substrate as illustrated in FIG. 3.

[0061] An exemplary embodiment of a method for using a fluid dispensingsystem to dispense discrete deposits of material onto the interiorsurface of an enclosing medium is shown as a flow diagram in FIG. 8.Aligning enclosing medium process 810 is used to align the opening inthe enclosing medium to the fluid ejector head so that the fluid ejectorbody may be inserted into the enclosing medium. The enclosing medium is,typically, in an enclosing medium tray or other holding device. The trayor other holding device is under the control of a transport mechanismand the transport controller. Any of the conventional techniques foraligning parts may be utilized. For example, an electric or pneumaticmotor or other actuator may move the tray or other holding device in Xand Y lateral directions to establish proper alignment of the enclosingmedium to the fluid ejector head. In addition, typically a theta orrotational alignment about a Z-axis will also be provided. Further,sensors located on the holding device, or an optical vision system orcombination thereof will, typically, be utilized to provide feed backthat the enclosing medium is properly aligned to the fluid ejector body.In alternate embodiments, the transport controller may be linked to afluid ejection cartridge or fluid ejector head, mounted to a dispensingbracket, providing movement of the fluid ejector body or both the fluidejector body and the holding device to properly align the enclosingmedium to the fluid ejector heads.

[0062] Inserting fluid ejector body process 820 is utilized to insertthe fluid ejector body into the opening of the enclosing medium. Thefluid ejector head is typically under the control of fluid ejectioncartridge or fluid ejector head position controller or transportmechanism and transport controller. For example, in one embodiment, anelectric or pneumatic motor may raise and lower in the Z direction thefluid ejector head providing the movement for inserting the fluidejector body into the opening of the enclosing medium. In alternateembodiments, the tray, or other holding device or a combination of thetray and the fluid ejector head are moved to insert the fluid ejectorhead into the opening of the enclosing medium.

[0063] Activating fluid ejector actuator process 830 is utilized toeject the fluid from at least one nozzle disposed on the fluid ejectorbody. Typically, a drop-firing controller or fluid controller in thefluid dispensing system, coupled to the fluid ejector head, activatesthe fluid ejector actuator, to eject drops of the fluid. For thoseembodiments, utilizing a fluid energy generating element, such aspiezoelectric or thermal resistor elements, the drop firing controllerwill, typically, activate a plurality of fluid energy generatingelements to eject essentially a drop of the fluid each time a fluidenergy generating element is activated. Typically the fluid energygenerating elements can reproducibly and reliably eject drops in therange of from about five femtoliters to about 10 nanoliters. Such a dropsize corresponds to deposits in the picogram to microgram rangedepending on the ratio of the amount of the desired material to bedeposited to the amount of solvent in the fluid drop ejected. However,depending on the particular application in which the fluid dispensingsystem is utilized, the size of these fluid drops can be controlled, inthe range from about 5 femtoliters to about 1 microliter. Such a dropsize corresponds to deposits in the picogram to milligram rangedepending on the ratio of the amount of the desired material to bedeposited to the amount of solvent in the fluid drop ejected.

[0064] Dispensing fluid process 840 is utilized to dispense and controlthe location of the ejected fluid drops on the inside surface of theenclosing medium to form the discrete agent deposits. Depending on theparticular fluid ejector head utilized, the fluid drops may be ejectedthrough the nozzles along a nozzle ejection axis, at a predeterminedejection angle from a fluid body normal. In one embodiment, the nozzleejection axis is aligned at an angle between about 0° and about 60° fromthe fluid body normal. In alternate embodiments, a fluid ejector headhaving a nozzle ejection axis aligned at an angle between about 0° andabout 45° from the fluid body normal may be utilized. Preferably, afluid ejector head with a nozzle ejection axis substantiallyperpendicular to a fluid ejector body longitudinal axis is utilized.,

[0065] In addition, depending on the particular fluid ejector bodyutilized dispensing fluid process 840 may also include an optionalrotational displacement process. The rotational displacement process isutilized, for example, to create rows of the discrete deposits for thoseembodiments utilizing fluid ejector heads having a single column ofnozzles for a particular fluid. By utilizing rotation, dispensing fluidprocess 840 may generate a two-dimensional array forming an arealdensity of fluid deposits on the interior surface of the enclosingmedium. Three-dimensional arrays may also be generated by dispensingfluid deposits on top of previously dispensed fluid deposits. Inaddition, for those embodiments utilizing fluid ejector heads havingmultiple columns of nozzles the rotational displacement may be utilizedto form rows of the discrete deposits having a smaller spacing betweendeposits than obtained with the same fluid ejector head withoutrotation. The rotational displacement may be accomplished by any of theconventional techniques utilized for rotation such as electrical orpneumatic motors, or piezoelectric motors to name just a couple ofexamples. The rotational displacement may be imparted to the enclosingmedium, to the fluid ejector body, or some combination thereof.

[0066] Dispensing fluid process 840 may also include an optionalvertical displace process. The vertical displacement process may beutilized to create columns of the discrete deposits having a smallerspacing between deposits than normally obtained with the same fluidejector head without vertical displacement. The fluid drop controllertypically controls the vertical displacement, however a separatecontroller may also be utilized. For example, the fluid drop controllermay be coupled to the tray position controller or the fluid ejector headcontroller or both to generate the appropriate vertical displacement. Inalternate embodiments, separate controllers and motors or otheractuators may be utilized to generate the appropriate verticaldisplacement. By utilizing various combinations of rotation and verticaldisplacement various structures may be generated, from simpletwo-dimensional arrays, or overlapping deposits forming a layer, to morecomplex structures such as three-dimensional arrays.

[0067] Referring to FIG. 9a an article of manufacture made using a fluiddispensing system according to an embodiment of the present invention isshown in a perspective view. In this embodiment, enclosing medium 906 iscontainer 930 that has interior surface 910 upon which is printedvarious alphanumeric characters 950 representing information in ahuman-perceptible form and bar code 940 representing information in amachine under stood form. Although the information depicted in FIG. 9ais what is commonly referred to as a “consumer coupon” alternateembodiments, may include any desirable consumer or manufacturinginformation. In addition the information can be any symbol, icon, image,or text or combinations thereof, such as a company logo or cartooncharacter. Other examples of various forms in which the information maybe presented are a one-dimensional bar code, a text message, a code, orhologram.

[0068] Referring to FIG. 9b an article of manufacture having a morevariable shape may also be made using a fluid dispensing systemaccording to an embodiment of the present invention is shown in aperspective view. In this embodiment, enclosing medium 906 is flexiblepackage 932 that has interior surface 910 upon which is printed, inreverse letters to be legible from the outside, various alphanumericcharacters 952. Alphanumeric characters 952 are generated using inkdeposits or dots (not shown) that are deposited on interior surface 910of flexible package 932 in patterns using dot matrix manipulation orother means. As described above in for FIG. 9a an image, alphanumericcharacters, or a machine understood code such as a one ortwo-dimensional bar code may be utilized.

[0069] Referring to FIG. 9c a label made on a gelatin capsule using afluid dispensing system according to an embodiment of the presentinvention is shown in a perspective view. In this embodiment, enclosingmedium 906 is gelatin capsule 934 that has interior surface 910 uponwhich is printed, pattern 954 using dot matrix manipulation or othermeans to generate an image, alphanumeric characters, or a machineunderstood code. In this embodiment the pattern 954 utilizes discreteink deposits (not shown) to generate the alphanumeric characters “agh3”printed on the inside of enclosing medium 906 in reverse letters to belegible from the outside. By printing on the inside of enclosing medium906, such characters or images are not as easily rubbed off or washedoff as for conventional packages printed either on the outside surfaceor on labels subsequently applied to the outer surface of the package.

What is claimed is: 1.-46. (Canceled).
 47. A method of manufacturing afluid ejector head, comprising: creating a fluid ejector body adapted tobe inserted into an opening of an enclosing medium, said medium havingan interior surface; forming at least one orifice on said fluid ejectorbody; and creating a drop-on-demand fluid ejector actuator in fluidcommunication with said at least one orifice, wherein activation of saiddrop-on-demand fluid ejector actuator ejects a fluid onto a discretelocation on said interior surface of said elongated enclosing medium.48. The method in accordance with claim 47, wherein creating a fluidejector body further comprises creating a substrate having at least oneactive device electrically coupled to said drop-on-demand fluid ejectoractuator.
 49. The method in accordance with claim 47, furthercomprising: forming a chamber layer over a substrate within said fluidejector body; defining side walls of at least one fluid ejection chamberabout said drop-on-demand fluid ejector actuator, said side walls formedin said chamber layer; and creating a nozzle layer over said chamberlayer wherein said nozzle layer includes said at least one orifice. 50.The method in accordance with claim 49, wherein creating a nozzle layerfurther comprises creating a micromolded nozzle layer having said atleast one orifice.
 51. The method in accordance with claim 49, whereinforming a chamber layer further comprises forming a micromolded chamberlayer having said sidewalls of said at least one fluid ejection chamber.52. The method in accordance with claim 47, further comprising: formingat least one fluid inlet channel in a substrate within said fluidejector body fluidically coupled to said at least one orifice; andforming a fluid channel within said fluid ejector body fluidicallycoupled to said at least one fluid inlet channel.
 53. The method inaccordance with claim 47, wherein creating said drop-on-demand fluidejector actuator further comprises creating at least one fluid energygenerating element.
 54. The method in accordance with claim 53, whereincreating at least one fluid energy generating element further comprisescreating at least one fluid energy generating element of a first typeand at least one fluid energy generating element of a second type.
 55. Afluid ejector head manufactured in accordance with the method of claim53.
 56. The method in accordance with claim 47, wherein creating saidfluid ejector body further comprises creating a fluid ejector bodyhaving a longitudinal axis, and wherein forming at least one orificefurther comprises forming at least one orifice having an orificeejection axis, wherein said longitudinal axis and said orifice ejectionaxis form a predetermined ejection angle.
 57. The method in accordancewith claim 56, wherein said predetermined angle is in the range fromabout minus sixty degrees to plus sixty degrees about a fluid bodynormal of said fluid body.
 58. A fluid ejector head manufactured inaccordance with the method of claim
 47. 59.-79. (Canceled).
 80. Themethod in accordance with claim 47, wherein creating said fluid ejectorbody further comprises creating said fluid ejector body having acylindrical portion including a diameter less than an inside diameter ofsaid opening of said enclosing medium.
 81. The method in accordance withclaim 47, wherein creating said fluid ejector body further comprisescreating said fluid ejector body having cylindrical outer surface, saidcylindrical outer surface having a longitudinal axis, wherein saidcylindrical outer surface conforms to said interior surface of saidenclosing medium.
 82. The method in accordance with claim 47, furthercomprising creating a first fluid channel fluidically coupled to said atleast one orifice.
 83. The method in accordance with claim 82, furthercomprising: forming at least one second fluid orifice disposed on saidfluid ejector body; creating a second fluid channel fluidically coupledto said at least one second fluid orifice; and creating a seconddrop-on-demand fluid ejector actuator in fluid communication with saidat least one second fluid orifice, wherein activation of said seconddrop-on-demand fluid ejector actuator ejects a second fluid onto saidinterior surface of said enclosing medium.
 84. The method in accordancewith claim 83, further comprising: forming at least one third fluidorifice disposed on said fluid ejector body; creating a third fluidchannel fluidically coupled to said at least one third fluid orifice;and creating a third drop-on-demand fluid ejector actuator in fluidcommunication with said at least one third fluid orifice, whereinactivation of said third drop-on-demand fluid ejector actuator ejects athird fluid material onto said interior surface of said enclosingmedium.
 85. The method in accordance with claim 47, wherein creatingsaid fluid ejector body further comprises creating said fluid ejectorbody having a curvilinear cross-sectional shape.
 86. The method inaccordance with claim 47, wherein creating said fluid ejector bodyfurther comprises creating said fluid ejector body having a polygonalcross-sectional shape.
 87. The method in accordance with claim 47,wherein forming said at least one orifice further comprises formingmultiple orifices.
 88. The method in accordance with claim 87, whereinforming said multiple orifices further comprises forming said multipleorifices in a helical configuration.
 89. The method in accordance withclaim 87, wherein forming said multiple orifices further comprisesforming said multiple orifices in a single helix configuration.
 90. Themethod in accordance with claim 87, wherein forming said multipleorifices further comprises forming said multiple orifices in a straightconfiguration.
 91. The method in accordance with claim 87, whereinforming said multiple orifices further comprises forming said multipleorifices in a staggered configuration.
 92. The method in accordance withclaim 47, wherein creating said fluid ejector body further comprisescreating said fluid ejector body having a conformal outer surfaceconforming to said interior surface.
 93. The method in accordance withclaim 47, wherein creating said fluid ejector body further comprisescreating a fluid ejector body having a fluid ejecting area wherein saidfluid ejecting area conforms to a deposition area of said interiorsurface of said enclosing medium over which fluid is to be deposited.